Gebraucht BACCINI / AMAT / APPLIED MATERIALS Softline 2.0 #9180318 zu verkaufen

Dual screen print line With automatic loader (2) 4 Station rotary print units (2) GP Solar chrome GP print-QFS CAM inspection stations (2) Drying ovens (1) Automatic unload Product configuration: Metallization Process direction: L to R Voltage: 480V Frequency: 60Hz GUI Language: English Anti-Seismic brackets Wafer form and Size: 156 X 156 Complete square Source inspection: Standard (1 Day) Local vacuum generators: Venturi type (CDA) System features: Printing sequence modules: (2) Printers configuration Line loader: Slide with buffer Type of magazine: Customized cassette Printer (First): Front Printing precision: High Kit15"(&12") (Screen holder, Squeegee, Flood bar) HP Printing nest Illuminator print precision: Illuminator (Red) Post-print vision system Auto reject feature Drying oven: Long profile (Horizontal) Buffer: Cell rotator (90°/180°) (50) Auto buffer Printer (Second): Front Printing precision-2: High Kit15"(&12") (Screen holder, Squeegee, Flood bar) HP Printing nests -2 Illuminator print precision -2: Illuminator (Red) Post-print vision system -2 Auto reject feature -2 Drying oven -2 : Long profile (Horizontal) Line unloader (Pre-firing): Slide with buffer Wafer vendor (Pre firing): Customized cassette Custom options: Metalization CES: (2) Enhancement kits (2) Long profile ovens (1) Loader shmid cassette (1) Unloader shmid cassette (2) Humidity ctrl ISO #1 filters Wafer clean teknek+ air ionizer Wafer: Substrate dimension: 156 mm x 156 mm Substrate thickness: min. 120 μm Substrate geometry: Full square or pseudosquare Wafers acceptable bowing: No bow (At room temperature, before firing, center to edge) < 4 mm (At room temperature after firing, center to edge) Wafers quality: Microcracks-free tested mechanically and optically Substrate geometrical tolerance: (L,W, Radius): ±0.5 mm Alignment fiducials inboard to the part / Print Alignment tolerance: +/- 20um Automation: Line type: Single lane Kind of substrate transport: Soft belt Substrate loading / Unloading: Automatic Loading / Unloading unit: Schmid 100 wafer cassettes Buffers (Capacity of wafers): 50 Per module Line performance: Gross throughput: 1600 cells/h Squeegee speed: 180mm/sec Print stroke: 180mm Breakage Rate: < 0.15 % Breakage rate spec Supplier dependent uptime (SEMI E10 standard): >92% System control + software: Computer hardware: PC With CAN bus Microsoft windows compatible: Windows XP embedded Acquired data compatible with access and excel MES Interface: SECS-GEM Compatible Characteristics Type of cassette: Cassette drawing attached Type of belt: Straight Loading on belt: Belt lifts up and pulls the cells out of the cassettes Buffer: (10) Cells storable in buffer Cassettes stored on the loading conveyor: 4 (+1 In loading position) Cells for each cassette: 100 Wafer Schmid cassettes Defect reduction kit Air knife Tacky roller Screen printing units Screen frame adaptor: 450x450mm (MKax. ext. dim.): 15” x 15” Possible screen size: 15" Screen frame (Support also 12" screens) Dedicated squeegee Flood bar Maximal printing area: 170x170 mm Maximal squeegee stroke: 240 mm Maximal squeegee speed: 330 mm/s Maximal squeegee pressure: 150 N XY-Adjustment: ± 10 mm Θ Adjustment: ± 5° Printing alignment repeatability: ± 15 μm Alignment camera (5) Installation cameras (1 Mp each) (3-4) Cluster cameras (Peripheral) (1) (Central) Special bracket mount for the cameras (7) Mounting positions (4) Illuminators kit: Red (Default) Edge (Center or corner) alignment / Repeatability for metal printing: Yes / 25 μm Printed pattern / Repeatability for metal printing: Yes / 15 μm Auto offset (Using pre-print camera): Yes Area: local / Full (Net of illuminators) Individual and independent print net offset: 4 (X, Y, Θ) Flexible location of cameras: Yes Kind of printing table: Auto reject feature Screen alignment: Automatic setup Options included on printer module: Humidity control: 32±2% HEPA Filter Characteristics: Mechanical arrangements to accept a vision system Transport belt section Cell presence sensor Fully line integration Inspection system integrated at BACCINI Centering device: Mechanical Long oven profile: Technical data and features (6) Heating zones (IR + air) (2) Exhausts Max wafer temperature: 350 °C Max air temperature tolerance: +/- 2 °C CDA Drying time: 36 sec Buffer description: The storage location store: 125 mm x 125 mm Cells 156 mm x 156 mm Cells Buffer characteristics: Main structure Lifting device (50) wafers fixed cassette magazine Working principle: LIFO Transport belt section Mechanicalcentering device Unloader slide with buffer characteristics: Type of cassette: 100 Wafer schmid cassette Type of belt: Straight Unloading on belt: Belt lifts up and put the cells on the cassettes Buffer: (10) Cells storable in buffer (5) Cassettes stored on the loading conveyor (In loading position) Cells for each cassette: Depending on cassette type 2014 vintage.