Gebraucht EVG / EV GROUP 620NT #9191006 zu verkaufen

Automated double side lithography system, 6" Exposure modes: Hard Soft Vacuum contact Proximity Separation distance: 0-300 μm adjustable Wafer thickness: 0.1-10 mm (For top side configuration only) Semi automatic loading Mechanical pre-alignment on chuck Quick change of mask and chuck Flat screen for operator interface and alignment functions, 17" PC Controlled operating environment Granite base frame construction Active vibration isolation Password protected access levels: Operator Engineer Maintenance Back side alignment of wafers: Mounted carrier Deep etched back side alignment marks Supports measuring of structures Cross hair distance Resolution with 10x objectives: 1.1 μm Light source NUV: 500 W-1000 W Lamp house: 350 W / 500 W Hg lamp Optical sets in NUV range: 280-450 nm Optimized parallel light: ±2%, 4" ±3%, 6" UV Probes: Diameter: 44.5 mm Height: 16 mm Optical set for wave length: 350 nm-450 nm Light sources: NUV / DUV Field lens, 6" Dielectric mirror Fly's eye lens Alignment stage fully motorized Fully motorized X, Y, Theta & Z alignment stage With DC motor controllers Automatic wedge compensation system Optimized print gap control WEC Contact force: 0.5-40 N adjustable Top side microscope: Motorized split field microscopes in visible light With high resolution CCD cameras for top and bottom side Travel range: X: 30 (8)-150 mm Y: -70 / +70 mm Storage of objective positions Digital zoom: 2x / 4x Image magnification for fine alignment (2) Objectives: 10x (3.6x - 20x) Bottom side microscope: Motorized split field microscopes in visible light With high resolution CCD cameras Bottom side alignment Travel range: X: 68 (48) mm-150 mm Y: ± 12 mm Digital zoom: 2x / 4x Image magnification fine alignment with objectives (2) Objectives: 10x (3.6x - 20x) Rack unit EVG 620 mask aligner systems: Integrates EVG 620 desktop alignment system Vibration isolated Robotic auto load system Robot module for auto load cassette to cassette: Size: 4"-6" With non contact optical prealigner for wafers With flat and notch Standard: With vacuum from bottom side Robot control fully integrated to EVG 620 Graphical User Interface (GUI) Cassette station: Send Receive Standby (5) Cassette stations: Cassette present sensor Cassette empty sensor Semi standard wafer cassette sizes IR Light source: Bottom side objectives IR-Transparent substrates Bottom side microscope: IR Light source manipulation IR Alignment of wafer to mask using top side microscope IR Lamp position with recipe Active cooled IR light source Manual and automatic alignment processes Usage of special IR objectives on topside microscope Reduces bottom side microscope travel range Pick and place handling option: Programmable send / receive / standby cassette configurations Up to 75 wafer processing on handling modules: (3) Cassette stations No operator intervention 125 wafer processing on handling modules: With (5) cassette stations No operator intervention Hard UV-Nano imprinting: UV-NIL Processes with hard stamps (Quartz glass) Top chuck, 1" stamps (in diameter) Bottom chuck: Microscope slides: 10 x 10 mm 15 x 15 mm 25 x 75 mm Diameter: 2"-4" Soft UV-NIL and μ-CP: PDMS Stamp to be mounted on glass back plane (5" square) Bottom chuck, 4" Loading frame, 1" Stamp Contact free wedge compensation with spacers Adjustable contact force for vacuum printing process Top chuck with quartz windows for UV curing of resist Optical alignment of stamp and substrate in two steps: Separation of stamp and substrate: Rough alignment Soft contact of stamp: Fine alignment Vacuum contact: 100 - 850 mbar Mask holder for 5" x 5" masks with loading frame Bottom loading system with automated vacuum transfer Hard coated & lapped surface finish for mask contact area Mask holder for 7" x 7" masks with loading frame Bottom loading system with automated vacuum transfer Hard coated & lapped surface finish for mask contact area Universal wafer chuck, 4" With spacers For automated handling Hard coated & lapped surface finish for wafer contact area Universal wafer chuck, 6" With spacers For automated handling Hard coated & lapped surface finish for wafer contact area Manual filter changing unit without filter / carrier Includes: Bond alignment Signal tower Does not include cassette load 2011 vintage.