Wafer Grinding, Lapping & Polishing - CINCINNATI
CAE has broad access to semiconductor related equipment direct from fabs, often unavailable through other sources. CAE finds the best deals on used CINCINNATI wafer grinding, lapping & polishing. CAE has 5 wafer grinding, lapping & polishing currently available for sale from CINCINNATI. You can choose from a selection of models, such as 2, 2MT or 325-12. We’re accountable for every transaction — CAE will seek to collect as much information as you require to ensure that you receive the equipment in the condition that you are expecting. Send us your request to buy a used CINCINNATI wafer grinding, lapping & polishing and we will contact you with matches available for sale.