Gebraucht UEDA / CYBEQ IP 8000 #153732 zu verkaufen

CMP polishing tool, 6" - 8" Designed to process up to (6) 6" / 8" wafers at once Integrated head retraction system Can be modified to include 4" / 5" wafers At a polish setting of 1 minute: Cycle time: 6.5 minutes Throughput: 55 wafers per hour Dual input wafer cassettes Load side cassette nests are designed to tilt from 0 to 90° Unload side cassette nests are open backed and remain at a constant 90° over (2) height adjustable DI water tanks Each cassette can hold up to (25) 6" / 8" wafers Each side holds (2) cassettes Previous processes run: STI, ILD, BPSG, Tungsten (single step Cabot slurry and specific pad), Poly Silicon (addition of a heated platen from a closed loop M&W heater / chiller), silicon wafer reclaim Wafer planarization of ~50 angstroms across surface of all wafers with a range between heads of <80 Edge exclusion of 3mm achievable Specifications: Polishing System: Employs 3 degrees of motion: platen, carousel, and carriers, plus eccentric motion Wafer Handling Capacity: 150 mm or 200 mm diameter (100/125mm possible) 2 Cybeq Articulated Robots 2 Head Loading Modules (HLMs) Dual input and output cassettes Wafer Carriers/Heads: 6 floating heads (patented design) Programmable retracting heads allow 2 to 6 wafers per polishing cycle Programmable speed from 1 to 30 rpm +/- 1% Programmable uniform down force air pressure from 1 to 10 psi Powered by a brushless servo motor Wafer Cleaning: Automated nozzle rinse with DI water after polishing Automated low pressure DI water polishing/cleaning cycle after polishing Platen: 36” diameter Made of number 304 stainless steel Polyurethane coated on exposed surfaces for acid based slurries Programmable speed from 1 to 35 rpm Programmable rotational direction, cw or ccw Powered by a brushless servo motor Optional temperature control unit Carousel: 30” diameter Made of anodized aluminium Polyester-urethane coated on exposed surfaces Programmable speed from 1 to 30 rpm Programmable rotational direction, cw or ccw Powered by a brushless servo motor Pad Dresser: Optional 4” or 12” diamond disc Programmable speed from 1 to 30 rpm Programmable down force from 0 to 200 lbs Slurry: Dual peristaltic pumps feeding through dual or separate PALL filters System Control: Microsoft Windows Graphical User Interface (GUI) with front and back TFT touch screen controllers/monitors Multiple steps of unlimited polishing recipes Siemens PLCs for motion control Fully automatic or semi-automatic operation Optionally SECSI, II, and GEM capable Facility: 200 –240 VAC, 3 phase 50 – 60 Hz, 60 amps maximum, AC – line filter CDA, 80-90 psi at 2 cfpm Nitrogen, 60 psi at 2 cfpm DI water, 2 to 4 gpm at 40 psi Slurry, 2 x 1/2” inputs, minimum 12psi.