Gebraucht VARIOUS Lot of equipment #293814816 zu verkaufen

Qty / Make / Model / Description (1) / DISCO / DFL 7160 / Laser dicing saw with Die Attach Film (DAF) laser grooving (2) / DISCO / DFL 7360 / Laser dicing saws (1) / ACCRETECH / PG 300 RM / Back grinding (BG) system (1) / EO TECHNICS / LMC-3200G / Laser grooving system (1) / ACCRETECH / ML 300 Plus / Laser dicing saw (2) / HANMI / 3500D / Saw sorters (2) / DISCO / DFD 6340 / Dicing saws (1) / CUON / CUWMM-120 / Tape mounter (2) / DISCO / DFD 6361 / Dicing saws (9) / SHINKAWA / SPA-300 / Die bonders (68) / K&S / Maxum Ultra / Wire bonders (1) / HITACHI / GXH-1 / Chip mounter (1) / HITACHI / GXH-3 / Modular mounter (1) / JINSUNG / JS-BO-2ZONE / Oven (1) / JINSUNG / JS-BO02F / Oven (2) / SEMES / SW5000 / Saw sorters (2) / DISCO / EAD 6340 / Saws (2) / KLA / ICOS / CI-T120 / Lead scanners (1) / VIEW / BENCHTOP300 / Inspection system (1) / SLT / SL-PCT18-01 / Failure analysis system (1) / NEURONFIT / HAS-70 / Analysis system (1) / VOETSCH / C4-180 / Climatic testing chamber (1) / R&B / METPOL-2(II) / Double disc grinder (1) / DAEYANG ETS / DYTS-555 / Temperature and humidity chamber (1) / HANMI / - / Flip Chip (FC) bonder off-loader (1) / DNC / DNC-2000ML / Unloader (1) / PSM / PTF-MLD2100 / Loader (1) / HANMI / - / Flip Chip (FC) bonder off-loader (1) / EUNIL / ESB-300 / NG Buffer (1) / MIRTEC / MV-7XI / Automated Optical Inspection (AOI) system (1) / HANMI / - / Flip Chip (FC) bonder in-buffer (1) / HANMI / A110 / Flip chip bonder (1) / HANMI / - / Flip Chip (FC) bonder loader (1) / PROTEC / Gang press shuttle / Snap cure buffer (1) / EUNIL / - / Inspection Table (1) / PROTEC / PB-500W / Burn-in (BIP) system (1) / GENESEM / GMDS-6000U / Inspection system (1) / DAI-ICHI SEICO / TS-PRO / Taping system (1) / GENESEM / GTAS-2100A / Pre-tape lamination system.